HyperX Impact HX429S17IBK2/32 memory module 32 GB 2 x 16 GB DDR4 260-pin SO-DIMM
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- Width
- 69.6 mm
- Height
- 30 mm
- Weight
- 15.2 g
- CAS latency
- 17
- Intended use
- Notebook
- JEDEC standard
- Y
- Voltage
- 1.2 V
- Row cycle time
- 45
- Capacity
- 32 GB
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Shopping actions
Overview
The HyperX Impact HX429S17IBK2/32 memory module 32 GB 2 x 16 GB DDR4 260-pin SO-DIMM features 32 GB of memory and DDR4. Full verified specifications are listed below.
Technical Specifications
General
11 SPECS
Intended use
Notebook
JEDEC standard
Yes
Row cycle time
45
Row active time
26.25
Module configuration
2048M x 64
Refresh row cycle time
350
Storage temperature
-55 - 100
Operating temperature
0 - 85
Programming power voltage (VPP)
2.5
Intel Extreme Memory Profile (XMP)
Yes
Intel Extreme Memory Profile (XMP) version
2.0
Physical
3 SPECS
Width
69.6 mm
Height
30 mm
Weight
15.2 g
Graphics
1 SPEC
Memory clock
2933 MHz
Logistics & Packaging
10 SPECS
Package depth
13.9 mm
Package width
95.5 mm
Package height
54.1 mm
Package weight
40.3 g
Country of origin
China
Master (outer) case width
101.6
Master (outer) case height
203.2
Master (outer) case length
311.1
Master (outer) case gross weight
1200
Products per master (outer) case
25
Memory
6 SPECS
CAS latency
17
Voltage
1.2 V
Capacity
32 GB
Form factor
260-pin SO-DIMM
Memory type
DDR4
Memory configuration
2 x 16
Market Value History
Sources
Product lifecycle
In production
Still listed as on-market by the manufacturer — actively sold and supported.
Lifecycle status is derived from catalog data and is indicative, not a manufacturer support guarantee.