MPN:
HX316LS9IBK2/8
HyperX 8GB DDR3-1600 memory module 2 x 4 GB 204-pin SO-DIMM
Released: Not on record
Price not yet available
US · Amazon.com
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- ECC support
- N
- Width
- 67.6 mm
- Height
- 30 mm
- Memory bus width
- 64 bit
- CAS latency
- 9
- NAND type
- PC3-12000
- Lead plating
- Gold
- Intended use
- Notebook
- Memory layout
- 2 x 4096
Shopping actions
Overview
The HyperX 8GB DDR3-1600 memory module 2 x 4 GB 204-pin SO-DIMM features 8 GB of memory and DDR3. Full verified specifications are listed below.
Technical Specifications
General
18 SPECS
Lead plating
Gold
Packaging type
SO-DIMM
Intended use
Notebook
Memory layout
2 x 4096
Bus clock rate
1600
Memory ranking
1
Number of pins
204
Row cycle time
48.125
Row active time
33.75
Error indication
No
Chips organisation
x8
Module configuration
512M x 64
Refresh row cycle time
260
Storage temperature
-55 - 100
Operating temperature
0 - 85
macOS versions supported
Yes
Linux distributions supported
Yes
Windows versions supported
Yes
Memory
8 SPECS
ECC support
No
CAS latency
9
Voltage
1.35 V
Capacity
8 GB
Form factor
204-pin SO-DIMM
Buffered/registered memory
Unregistered (unbuffered)
Memory type
DDR3
Memory configuration
2 x 4
Physical
3 SPECS
Width
67.6 mm
Height
30 mm
Colour
Black
Graphics
2 SPECS
Memory bus width
64 bit
Memory clock
1600 MHz
Storage
1 SPEC
NAND type
PC3-12000
Market Value History
Sources
Product lifecycle
In production
Still listed as on-market by the manufacturer — actively sold and supported.
Lifecycle status is derived from catalog data and is indicative, not a manufacturer support guarantee.
