XPG SX6000 1 TB M.2 PCI Express 3.0 NVMe 3D TLC
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- Capacity
- 1 TB
- Form factor
- M.2
- Read speed
- 1000 MB/s
- Write speed
- 800 MB/s
- Interface
- PCI Express 3.0
- NAND type
- 3D TLC
- NVMe
- Y
- Depth
- 22 mm
- Width
- 80 mm
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Overview
The XPG SX6000 1 TB M.2 PCI Express 3.0 NVMe 3D TLC features a 1 TB SSD, Heatsink cooling and NVMe support. Full verified specifications are listed below.
Technical Specifications
Logistics & Packaging
9 SPECS
Package depth
143 mm
Package width
100 mm
Package height
20 mm
Package weight
34.5 g
Master (outer) case width
346
Master (outer) case height
280
Master (outer) case length
445
Master (outer) case gross weight
3671
Products per master (outer) case
60
Ports & Connectivity
1 SPEC
Interface
PCI Express 3.0
Cooling
1 SPEC
Cooling type
Heatsink
Storage
5 SPECS
Read speed
1000 MB/s
NAND type
3D TLC
Write speed
800 MB/s
Capacity
1 TB
Form factor
M.2
Physical
5 SPECS
Depth
22 mm
Width
80 mm
Height
3.5 mm
Weight
8 g
Colour
Black
General
24 SPECS
NVMe
Yes
TBW rating
600
NVMe version
1.2
Packaging type
Box
Certifications
CE, FCC, BSMI, VCCI, KC
Intended use
PC/Notebook
NAND flash type
TLC (Triple Level Cell)
Operating shock resistance
1500
Random read (4KB)
100000
Random write (4KB)
110000
Compliance certificates
RoHS
Power draw (idle)
0.14
Storage temperature
-40 - 85
Brand specific technologies
SLC Caching
Operating temperature
0 - 70
Power consumption (average)
0.33
Sequential read speed (CDM)
1000
Sequential read speed (ATTO)
1000
Sequential write speed (CDM)
800
Sequential write speed (ATTO)
800
Sequential read speed (AS SSD)
930
Sequential write speed (AS SSD)
700
PCI Express interface data lanes
x2
MTBF
2000000
Market Value History
Sources
Product lifecycle
In production
Still listed as on-market by the manufacturer — actively sold and supported.
Lifecycle status is derived from catalog data and is indicative, not a manufacturer support guarantee.